Page 55 - 電路板季刊第112期

電路板季刊 2026.7 專業技術 53

參考資料：
1. Novel formaldehyde-free electroless copper for plating on next-generation
substrates.- IMAPS 2018 - 51st International Symposium on Microelectronics -
Pasadena, CA USA - Oct. 8-11, 2018

2. The Formation of Nano-voids in electroless Cu Layers. MRS Advances 4 ,
2231–2240 (2019). https://doi.org/10.1557/adv.2019.336
3. Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field
Study. 國際微電子學研討會（2019）

4. Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/
Cu Interfaces in Stacked Blind Micro Via Structures. 2021 IEEE 71st Electronic
Components and Technology Conference (ECTC)
5. To solve Weak-Micro Via High connection reliability Electroless copper plating
process OPC FLET PROCESS-(OKUNO)-2026

6. Mechanism of void growth in electroless copper plating layer of micro vias in
high density interconnect packaging substrates. Hsieh et al. Journal of Materials
Science: Materials in Engineering (2026) 21:5 https://doi.org/10.1186/s40712-
025-00374-w
7. CHARACTARIZATION OF FORMALDEHYDE-FREE ELECTRO-LESS COPPER
PLATING FOR SEMI-ADDITIVE PROCESS- IMAPS 2021 - 54th International
Symposium on Microelectronics | October 11-14, 2021 | San Diego, CA USA.

8. T. Sharma, R. Brüning, T. Nguyen, T. Bernhard, F. Brüning, “Properties of
electroless Cu films optimized for horizontal plating as a function of deposit
thickness,＂ in Microelectronic Engineering, 2015, 140, pp. 38–46..
9. H. Heer, R. Wong,＂ Reliability of stacked microvia＂, IPC APEX EXP
Conference Proceedings (2015)

10. 麥德美SHADOW PLUS技術資料
11. ATO Bond Film技術資料

12. 林定皓-電路板濕製程技術與應用-2019版
13. 景碩堆疊孔實驗報告-2021卓育萱

14. 專利：US 2004/0253450 A1-Pub. Date: Dec. 16, 2004