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Submit your abstract by June 22, 2026
Accepted papers will be published in IEEE Xplore
Since its inception in 2006, the IMPACT Conference has served as an international conference for research exchange
across the packaging, PCB, and semiconductor ecosystem, bringing together academia and industry to advance electronic
technologies and systems.
Recent advances in artificial intelligence (AI), high-performance computing (HPC), and heterogeneous integration are
reshaping modern electronics. As AI moves beyond data centers to system-level deployment and practical applications,
performance, power efficiency, and reliability increasingly depend on hardware integration. Advanced packaging and PCB
technologies play a central role in enabling scalable and energy-efficient AI systems.
IMPACT-IAAC 2026 adopts the theme “Energy-Efficient AI: From Computing to Systems and Applications.” The conference
focuses on key enabling technologies in electronic packaging and PCB, addressing innovations that bridge device-level
performance with system-level integration and practical implementation. Topics include advanced packaging, heterogeneous
integration, IC substrates, high-speed/high-frequency PCB, thermal management, reliability, manufacturing processes,
materials, and sustainability.
IMPACT-IAAC 2026 provides an international platform for researchers and engineers to present and discuss original
technical contributions in advanced electronic systems. Researchers and practitioners are invited to submit their latest work
and share developments with the international community.
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【 Date 】Oct. 19 (Mon.)-22 (Thur.), 2026 【Program Features】 Plenary speech、Industrial session、
【 V enue 】 Grand Hilai Taipei (Oct.19) Special session、Invited talks、PDC
Taipei Nangang Exhibition Center II (Oct.20-22) 【Co-located Exhibitions】 TPCA Show, TAITRONICS,
【 Theme 】 Energy-Efficient AI: AIoT Taiwan
From Computing to Systems and Applications 【On-line Submission】www.impact.org.tw
【Organizer】IEEE-EPS、iMAPS Taiwan、ITRI、TPCA
IMPORTANT DATE
Item
Remark
Date
Item Date Remark
400-500 words, 1-2 pages
Abstract Submission Deadline Jun. 22 400-500 words, 1-2 pages
Abstract Submission Deadline
Jun. 22
Submit online www .impact.org.tw
Submit online www.impact.org.tw
Jul. 20
Abstract Acceptance Notification Jul. 20 Notice sent via email
Notice sent via email
Abstract Acceptance Notification
Advanced Program Online
Advanced program announcement
Advanced Program Online Aug. 21 Advanced program announcement
Aug. 21
4 pages including figures and tables
Aug. 28
Full Paper Submission Deadline Aug. 28 4 pages including figures and tables
Full Paper Submission Deadline
Submit on-line through the conference website
Submit on-line through the conference website
SCOPE OF PAPER SOLICITED
Packaging PCB
P1. Advanced Packaging Technologies B1. Sustainable Materials and Manufacturing Technology
P2. Power Electronics Packaging B2. Smart Manufacturing, Inspection and Testing
P3. Interconnections & Nanotechnology B3. HDI PCB, IC Substrate and FPC Technology
P4. Design, Modeling, AI/Machine Learning Applications, and Testing B4. Advanced and Emerging Technology
P5. Advanced Materials, Automatic Process & Assembly * Papers relevant to the above scopes are encouraged to submit but NOT limited to.
* Conference organizer keeps the right to finalize session arrangement.
P6. Emerging Systems Packaging Technologies * Authors of accepted papers including oral presentations and posters should register
before the deadline; please be noted that unregistered (paid) papers will be removed
P7. Sustainable Technologies & Systems from the conference program.
* The organizer reserves the right to modify the agenda.
PAPER AWARD CONTACT
Outstanding Paper Award will be elected by IMPACT Technical IMPACT 2026 secretariat:
Program Committee from student and industrial papers respectively. Taiwan Printed Circuit Association(TPCA)
The paper awardees will be announced and honored next year. TEL: +886-3-3815659 #404 Sophia #407 Cindy #406 Vivi
Evaluation criteria: Originality, Completeness, Significance, Industrial E-mail: service@impact.org.tw
merit of the abstract, full paper, and presentation. http://www.impact.org.tw
ORGANIZER CO- ORGANIZER PARTNERS