Page 42 - 電路板季刊第109期

40 專業技術 低碳光阻剝除劑材料技術

V. Reference

[1] https://www.ipcb.tw/tech/103.html
[2] https://zh-tw.liangdar.com.tw/printed-circuit-board-process

[3] https://www.dupont.com/blogs/smartphone-functionality-new-metallization-

processes.html
[4] https://greatpcb.com/zh-TW/fcb-fab/hdi-pcb/

[5] J. Micromech. Microeng. 17 (2007) R81–R95. SU-8: a photoresist for high-
aspect-ratio and 3D submicron lithography. DOI:10.1088/0960-1317/17/6/R01

[6] https://www.alfa-chemistry.com/photoresist/pcb-photoresists.html

[7] J Micromech Microeng. 2014 May 1; 24(5): 057002. Print-to-Pattern Dry Film
Photoresist Lithography. DOI: 10.1088/0960-1317/24/5/057002

[8] Dry Film Resists for Fine Line and Space Patterning, “RY-5100UT series＂
https://www.resonac.com/sites/default/files/2022-12/en_pdf-rd-report-061-61_
tr05.pdf; DuPont™™ Riston® DI1500 & DI1600M dry film photoresist乾膜
光阻https://www.dupont.com/content/dam/dupont/amer/us/en/kalrez/public/
documents/en/Fine%20Line-Riston%C2%AEDI1500_1600M.pdf

[9] https://www.ncabgroup.com/hdi-high-density-interconnect-pcb/

[10] 先進微系統與構裝技術聯盟第九十四期季刊, 2024, p69-83