Page 44 - 電路板季刊第109期

42 專業技術 Dry film 介電材料技術 Dry film dielectric material technology

ʧཥҿࣘҦஔ
Dry film ʧཥҿࣘҦஔ
Dry film

Dry film dielectric material technology
Dry film dielectric ma teria l techno log y

蘇育央 Yu-Yang Su 工業技術研究院(ITRI) 材料與化工研究所 資深研究員

࿜ࠅ
隨著消費性電子、智慧車、自動化設備、與物聯網等產品都邁向低功耗、高性
能與可靠度、以及輕薄短小的趨勢，因此PCB必須持續開發新穎製程，例如超精細線
路電鍍/蝕刻、鐳射直接成像、半加成法(MSAP)、封裝基板等來滿足市場需求，而乾
膜正是關鍵材料之一。乾膜技術變廣泛導入於軟板、硬板、軟硬結合版與IC載板等元
件，應用於通訊、電腦、消費電子、汽車工業、軍工、航太工業等產品。例如，感光
聚醯亞胺(PSPI, photosensitive polyimide)為具有低介電、高解析度、熱穩定性、機
械特性、與良好抗化性等特性，可大幅提升先進的封裝技術，朝整合更多異質晶片進
行，最終應用於透明顯示、高速運算AI和專業性電子產品。

Abstract
As consumer electronics, smart cars, automated equipment, and the Internet
of Things (IoT) continue to trend toward low power consumption, high performance
and reliability, and thinness and size, PCB manufacturing must continue to develop
innovative processes, such as ultra-fine circuit plating/etching, laser direct imaging,
semi-additive process (MSAP), and package substrates, to meet market demand.

Dry film technology is a key material for this. Dry film is widely used in flexible
and rigid PCBs, FCCL, and IC substrates, finding applications in communications,
computers, consumer electronics, automotive, military, and aerospace industries.
For example, photosensitive polyimide (PSPI) processed low dielectric constant,
high resolution, thermal stability, mechanical properties, and excellent chemical
resistance. It can significantly enhance advanced packaging technology, enabling
the integration of more heterogeneous chips, ultimately leading to applications in
transparent displays, high-speed AI computing, and specialized electronic products.

ᗫᒟο(Keywords)
乾膜(Dry film), 感光聚醯亞胺(photosensitive polyimide）、低介電常數(dielectric
constant material)、低介電損耗 (dielectric loss material)、高解析度(high resolution )