Page 121 - 電路板季刊第111期
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電路板季刊 2026.4 產業脈動 119
From ABF to T-Glass: the next supply Each of these materials shares
/shortage? the same structural vulnerabilities that
This material shortage is becom- made ABF and T-Glass into potential
ing a pattern the semiconductor pack- risks of full supply chain shutdown.
aging supply chain. It reflects the Concentrated supply bases, multi-year
existence of weak points and potential lead times for capacity expansion, long
risks. and expensive qualification cycles, and
a historical industry culture that treated
The question the industry must
now confront is not whether the next upstream materials as interchange-
bottleneck will emerge, but which mate- able commodities rather than strategic
rial it will be. assets.
The geopolitical dimension com-
The candidates are already visi-
ble: pounds the technical and commercial
risks. Europe and the United States
• HVLP4 and HVLP5 copper foils, where have, to date, made no meaningful
Mitsui has been pushed to triple its moves to establish domestic or regional
expansion plans within a single year production of advanced glass fiber, spe-
yet still cannot match demand pro- cialty copper foils, or high-end CCLs,
jections, despite the fact that these materials are
• Solder masks and photo imageable now, by any reasonable definition, stra-
dielectrics required for finer-pitch tegic assets for national security and
interconnects, economic competitiveness.
• Specialty resin systems for M8-grade And the Japanese government
and beyond CCLs, and even the has recognized the stakes, approving
coated drill bits needed to process Nittobo's Fukushima expansion under
increasingly complex multilayer the Economic Security Promotion Act
boards. and providing subsidies.
So, what are the next steps?
