Page 119 - 電路板季刊第111期
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電路板季刊 2026.4       產業脈動 117


             •  And Fulltech Fiber Glass, Asahi-              The compounding effect of simul-
              Schwebel Taiwan, and even Nittobo's        taneous shortages across glass, cop-
              Taiwanese subsidiary Baotek are fol-       per, tungsten, and precious metals is
              lowing suit.                               producing a cost environment that the

                 The phase-outs, scheduled to            IC substrates and PCB industries have
            accelerate through the second half of        not experienced in decades.
            2026, will remove mainstream CCL              •  More strategically, the reallocation
            products from the Taiwanese market             of Taiwanese and Japanese manu-
            entirely, with affected orders expected        facturing capacity toward high-end
            to migrate to Chinese factories.
                                                           materials  is  accelerating  China's
                 The implications of this shift are        consolidation  of  the  mid-  and  low-
            profound and multi-layered.                    end PCB materials market.
             •  First on the pricing front. Indeed,           TUC itself has confirmed that its
              the tightening has already produced        China and Thailand factories are “full
              cumulative price increases of almost       go on E-glass CCL" and could supply
              100% for lightweight glass fabrics         Taiwanese PCB manufacturers directly.

              and over 150% for heavy-weight fab-
              rics in the current cycle.                      This new reversal would deepen
                                                         the global electronics industry's depen-
                 Resonac, a key CCL and prepreg
            supplier, announced a 30% price              dence on Chinese supply for consumer
            increase across its entire CCL and pre-      products even as geopolitical tensions
            preg portfolio effective March 2026. A       push governments toward supply chain
            move seen far from just a routine cost       diversification.
            adjustment but as a structural inflec-            For automotive, industrial, and
            tion point reflecting that pricing power     consumer electronics OEMs that rely
            has shifted upstream.                        on  standard  FR-4,  the  message  is

                 Raw material cost escalation is         unambiguous.
            not confined to glass: copper foil prices         The  E-glass  capacity  that  once
            have hit record levels, with HVLP4-          served their needs is being perma-
            grade  foils  essential  for AI  server      nently repurposed, and the alternative
            PCBs in particularly tight supply, tung-     sources are overwhelmingly located
            sten carbide, from which the drill bits      in mainland China. The structural sup-
            and routers used in PCB fabrication          ply gap for high-end glass fiber cloth
            are made, has surged 5x in the past
            year,  and  gold's  price  above  $5,300     is estimated at 20–30% overall and
            per ounce has increased ENIG surface         exceeds 40% for the most advanced
            finish costs by 35–40%.                      products.
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