Page 120 - 電路板季刊第111期
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118 產業脈動 AI supply chain at risk: the T-Glass factor
Monthly demand for first-genera- tightly coupled serial process. A risk or
tion low-Dk glass fiber alone will reach constraint at any single phase prop-
approximately 15 million meters in agates directly to end-system ship-
2026, against a combined global pro- ments.
duction capacity (including new capac- • Unimicron has publicly stated that
ity coming online) of roughly 10 million T-Glass delays have pushed out lead
meters. Even as Taiwan Glass invests times for ABF-based IC substrates
NT$2.25 billion to quadruple its low-Dk used in CoWoS packaging.
production lines and targets a 40–50%
share of the secondary supply base, At Yole Group, analysts expect
and as Fulltech aims to raise its high- supply conditions to shift from relative
end capacity share to over 50%, the balance to tightness in the second half
supply-demand arithmetic suggests of 2026, with price increases for high-
that a potential relief is unlikely before speed PCIe Gen5 and Gen6 SSD con-
late 2027. trollers potentially starting as early as
Q2 as inventories decline.
The downstream effects are
already visible in AI hardware deliv- The constraint is no longer at the
ery schedules. The supply chain from silicon level. AI demand is now being
T-Glass through CCL through ABF limited by T-Glass capacity, specifi-
films through to finished ASIC and cally the output of glass furnaces in
GPU server modules operates as a Fukushima and Chiayi.
