Page 62 - 電路板季刊第109期
P. 62

60  專業技術      從表面改質到智慧監測:電漿技術的優勢與挑戰


            (5)  Becker,  K.  Microplasmas,  a  platform  technology  for  a  plethora  of  plasma
                applications. The European Physical Journal Special Topics 2017, 226 (13),
                2853–2858, journal article. DOI: 10.1140/epjst/e2016-60375-4.

            (6)  Bruggeman, P. J.; Kushner, M. J.; Locke, B. R.; Gardeniers, J. G. E.; Graham,
                W. G.; Graves, D. B.; Hofman-Caris, R.; Maric, D.; Reid, J. P.; Ceriani, E.; et al.
                Plasma-liquid interactions: a review and roadmap. Plasma Sources Science &
                Technology 2016, 25 (5). DOI: 10.1088/0963-0252/25/5/053002.

            (7)  Kim, K. N.; Lee, S. M.; Mishra, A.; Yeom, G. Y. Atmospheric pressure plasmas
                for surface modification of flexible and printed electronic devices: A review.
                Thin Solid Films 2016, 598, 315–334. DOI: 10.1016/j.tsf.2015.05.035.

            (8)  Huang, Y. C.; Lin, Y. X.; Hsiung, C. K.; Hung, T. H.; Chen, K. N. Cu-Based
                Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-
                Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials (Basel)

                2023, 13 (17). DOI: 10.3390/nano13172490  From NLM.
            (9)  Zhao, Z.-H.; Gao, L.-Y.; Liu, Z.-Q. Review of Cu–Cu direct bonding technology

                in advanced packaging. Nanotechnology 2025, 36 (26), 262001. DOI:
                10.1088/1361-6528/addf54.
            (10)  Chang,  T.-M.;  Wang,  C.-Y.;  Hsu,  C.-C.  Development  of  a  real-time  and

                 multitasking system for long-term monitoring of aqueous metallic elements
                 using  plasma  spectroscopy.  Talanta  2024,  271,  125688.  DOI:  https://doi.
                 org/10.1016/j.talanta.2024.125688.

            (11)  Wang, C.-Y.; Hsu, C.-C. Online, Continuous, and Interference-Free Monitoring
                 of  Trace Heavy Metals in Water Using Plasma Spectroscopy Driven by
                 Actively Modulated Pulsed Power. Environmental Science & Technology 2019,
                 53 (18), 10888–10896. DOI: 10.1021/acs.est.9b02970.
   57   58   59   60   61   62   63   64   65   66   67