Page 50 - 電路板季刊第109期

48 專業技術 Dry film 介電材料技術 Dry film dielectric material technology

圖五、PSPI薄膜(厚度10 µm) UV光譜圖

ʞeഐሞ

乾膜技術雖已發展趨於成熟，但高性能之乾膜於高階的產品與先進製程的應用仍
充滿機會與挑戰並存，日益增長的環境問題以及對永續製造流程的需求是推動乾膜市
場發展的重要因素。需以策略創新、具成本效益的製造和永續性以應對市場的複雜性
並確保競爭優勢。這種向綠色實踐的轉變為企業創新和開發生物基或環保乾膜光阻配
方提供了機會。感光絕緣材料如PSPI，因具有低溫硬化、低殘餘應力，低介電常數、
低介電損耗以及高解析度等特點，適用於PCB、FCCL、顯示元件、IC封裝、半導體
封裝製程中，並解決新材料製程之介面問題。

ਞϽ˖ᘠ
1. Photosensitive Polyimide Market Size, Share, Growth and Industry Analysis, By Type
(Positive Photosensitive Polyimide and Negative Photosensitive Polyimide), By Application
(Display Panel, Chip Packaging and Printed Circuit Board), Regional Forecast To 2033.

2. Enhancing Performance in Top-Illuminated Shortwave Infrared Organic Photodetectors via
Microcavity Resonance, Adv. Optical Mater. 2024, 2401806.

3. https://www.asahi-kasei.com/
4. Organosoluble and colorless fluorinated poly(ether imide)s containing a bulky fluorene
bis(ether anhydride) and various trifluoromethyl-substituted aromatic bis(ether amine)s:
synthesis and characterization, Iranian Polymer Journal, Volume 32, pages 499–511, (2023).
5. Organosoluble and Light-Colored Fluorinated Polyimides Prepared from Bis[4-(4-amino-2-
trifluoronethylphenoxy)phenyl]ether and Aromatic Dianhydrides, Polymer Science, Series
B, 65 (14), 514-527, 2023.

6. Novel Thick Dry Film Photoresist and Process Optimization for High-Aspect Cu Pillar
Patterning," 2025 IEEE 75th Electronic Components and Technology Conference (ECTC),
Dallas, TX, USA, 2025, pp. 1342-1346, doi: 10.1109/ECTC51687.2025.00230.