Page 33 - 電路板季刊第110期

電路板季刊 2026.1 專業技術 31

ҿࣘ৷᎖ʧཥत׌ඎ಻Ҧஔʘ೯࢝
ҿࣘ৷᎖ʧཥत׌ඎ಻Ҧஔʘ೯࢝

Development of High-Frequency Dielectric Properties
Development of High-Frequency Dielectric Properties
Measurement Techniques for Materials
Measurement Techniques for Materials

陳炯雄
工業技術研究院材料與化工研究所 資深工程師

࿜ࠅ

隨著行動通訊技術由 5G 邁向 6G，全球正面臨高速傳輸、低延遲與大規模連結
的新挑戰。6G 的資料傳輸速率預期將達到 Tbps 級別，不僅滿足沉浸式應用與全息通
訊，更將推動智慧製造、車聯網與空天地整合通訊之發展。為支援這些應用，通訊頻
段將持續往毫米波（mmWave）、次太赫茲（sub-THz）甚至太赫茲（THz）區間推
進。然而，高頻段雖可提供極大頻寬，但其傳輸距離短、衰減高，對材料特性與系統
設計提出嚴峻挑戰。材料在高頻電場下的介電行為，已成為影響元件與模組效能的核
心關鍵。本文從未來通訊技術發展需求出發，探討高頻材料介電特性量測的現有方法
與平台建置，並說明其對 6G 及後續世代通訊生態系的戰略重要性。
As mobile communication technology advances from 5G to 6G, the world
is facing new challenges in achieving ultra-high data rates, ultra-low latency, and
massive connectivity. 6G is expected to support data transmission rates at the
terabit-per-second (Tbps) level, enabling immersive applications and holographic
communications, while driving the development of smart manufacturing, vehicular
networks, and integrated space-air-ground communication systems. To support
these applications, communication frequency bands will continue to expand into the
millimeter-wave (mmWave), sub-terahertz (sub-THz), and even terahertz (THz) ranges.
However, although higher frequency bands can provide enormous bandwidth, their
short transmission distance and high attenuation impose stringent requirements on
material properties and system design. The dielectric behavior of materials under high-
frequency electromagnetic fields has therefore become a key factor that directly affects

the performance of devices and modules. This paper, from the perspective of future
communication technology development, explores existing methods and platform
implementations for high-frequency dielectric property measurements, and emphasizes
their strategic importance for the 6G and beyond communication ecosystem.
關鍵字：高頻材料、介電特性、毫米波、次太赫茲、量測技術